The Thermal Design of an LSI Single-Chip Package
- 1 December 1976
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 12 (4) , 371-378
- https://doi.org/10.1109/tphp.1976.1135155
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- The effect of some composite structures on the thermal resistance of substrates and integrated circuit chipsIEEE Transactions on Electron Devices, 1973