Interconnect and circuit modeling techniques for full-chip power supply noise analysis
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (3) , 209-215
- https://doi.org/10.1109/96.704931
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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