Fluidic self-assembly of InGaAs vertical cavitysurface emitting lasers onto silicon

17 August 1995

journal article
Published by Institution of Engineering and Technology (IET) in Electronics Letters

Vol. 31 (17) , 1448-1449
https://doi.org/10.1049/el:19950989

Abstract

Vertical cavity surface emitting lasers (VCSELs) have been successfully integrated by fluidic self-assembly (FSA) into 10 µm deep holes etched into an Si substrate. These 40 × 40 × 10 µm³ devices were fully planarised and metallised after integration. The VCSELs operated pulsed at 0.98 µm with a threshold current as low as 75 mA and a turn-on voltage of 2.9 V.

Keywords

2.9 V
ETCHING
INGAAS
0.98 MICRON
SURFACE EMITTING LASERS
75 MA
FLUIDIC SELF-ASSEMBLY
SI SUBSTRATE
VERTICAL CAVITY SEL
OEIC
VCSEL

This publication has 2 references indexed in Scilit:

Selectively oxidised vertical cavity surface emittinglaserswith 50% power conversion efficiency
Electronics Letters, 1995
Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates
IEEE Photonics Technology Letters, 1994