Microstructures and subcritical crack growth in oxidized hot-pressed Si3N4
- 1 September 1982
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 17 (9) , 2486-2494
- https://doi.org/10.1007/bf00543879
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Fracture Toughness and High‐Temperature Slow Crack Growth inSiCJournal of the American Ceramic Society, 1980
- The compression creep behaviour of silicon nitride ceramicsJournal of Materials Science, 1978
- Slow Crack Growth from Controlled Surface Flaws in Hot‐Pressed Si3N4Journal of the American Ceramic Society, 1978
- The Rate Controlling Process in the Oxidation of Hot Pressed Silicon NitrideJournal of the Electrochemical Society, 1977
- Oxidation of Si3N4 in the Range 1300° to 1500°CJournal of the American Ceramic Society, 1976
- Thermodynamics and kinetics of oxidation of hot-pressed silicon nitrideJournal of Materials Science, 1976
- Oxidation Behavior of Hot‐Pressed Si3N4Journal of the American Ceramic Society, 1975
- Acoustic emission and crack propagation in polycrystalline aluminaMaterials Science and Engineering, 1974
- Crack propagation and failure prediction in silicon nitride at elevated temperaturesJournal of Materials Science, 1974
- High‐Temperature Strength Behavior of Hot‐Pressed Si3N4: Evidence for Subcritical Crack GrowthJournal of the American Ceramic Society, 1974