Evaluation of a three-dimensional memory cube system
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 1006-1011
- https://doi.org/10.1109/33.273703
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- High-density memory packaging technology high-speed imaging applicationsPublished by SPIE-Intl Soc Optical Eng ,1991
- 3-D interconnection for ultra-dense multichip modulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990