Underfill constraint effects during thermomechanical cycling of flip-chip solder joints
- 1 April 2002
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (4) , 253-264
- https://doi.org/10.1007/s11664-002-0141-4
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- The effects of underfill on the reliability of flip chip solder jointsJournal of Electronic Materials, 1999
- Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solderMetallurgical and Materials Transactions A, 1999
- Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit BoardsCircuit World, 1993
- Modeling of the Thermomechanical Fatigue of 63Sn-37Pb AlloyPublished by ASTM International ,1993