Integrated-circuit thermal modeling
- 1 June 1978
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
- Vol. 13 (3) , 363-366
- https://doi.org/10.1109/jssc.1978.1051054
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Computer simulation of integrated circuits in the presence of electrothermal interactionIEEE Journal of Solid-State Circuits, 1976
- A thermal model for high power devices designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1974
- Thermal analysis of multiple-layer structuresIEEE Transactions on Electron Devices, 1974
- Analysis and design of temperature stabilized substrate integrated circuitsIEEE Journal of Solid-State Circuits, 1974
- A 15-W monolithic power operational amplifierIEEE Journal of Solid-State Circuits, 1972
- Steady-state junction temperatures of semiconductor chipsIEEE Transactions on Electron Devices, 1972
- Analysis of Electrothermal Integrated CircuitsIEEE Journal of Solid-State Circuits, 1971