High temperature intergranular damage and fracture
- 30 August 1997
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 234-236, 30-36
- https://doi.org/10.1016/s0921-5093(97)00172-x
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Microstructural parameters for creep damage quantificationActa Metallurgica et Materialia, 1991
- Intergranular fracture in copper under high temperature creep, fatigue and creep-fatigue conditionsScripta Metallurgica et Materialia, 1990
- Percolation theory and its ramificationsContemporary Physics, 1980