Building-in reliability: soft errors-a case study
- 1 January 1992
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
A case is described for implementing building-in reliability. The case study deals with the phenomenon of soft-error rates in DRAMs. It is shown that the process begins with looking at output variables and then working backwards to identify the key input variables that affect the output variables. The authors demonstrate how monitoring the identified input variables leads to a stable process in manufacturing. In addition, they have identified a new source of alpha particles that contributes to the soft error rate of memory ICs, namely, the phosphoric acid used during wafer fabrication. The findings show that the raw materials used in wafer fabrication are at least as great a source of alpha particle emissivity as are packaging materials.<>Keywords
This publication has 3 references indexed in Scilit:
- Soft Error Rate Reduction in Dynamic Memory with Trench Capacitor Cell8th Reliability Physics Symposium, 1986
- Alpha-Particle-Induced Soft Errors and 64K Dynamic RAM Design Interaction8th Reliability Physics Symposium, 1980
- A New Physical Mechanism for Soft Errors in Dynamic MemoriesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1978