Barrier behaviour of TiW between copper and aluminium
- 16 December 1988
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 110 (2) , K77-K79
- https://doi.org/10.1002/pssa.2211100246
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- The effects of processing parameters on the microstructure and properties of sputter-deposited TiW thin film diffusion barriersThin Solid Films, 1987
- Studies of the Ti-W/Au metallization on aluminumThin Solid Films, 1978
- Application of Ti: W barrier metallization for integrated circuitsThin Solid Films, 1978
- Studies of the Ti‐W Metallization System on SiJournal of the Electrochemical Society, 1976