Characterization of the electrostatic bonding of silicon and Pyrex glass
- 1 June 1995
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 5 (2) , 98-102
- https://doi.org/10.1088/0960-1317/5/2/010
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Extremely miniaturized capacitive movement sensors using new suspension systemsSensors and Actuators A: Physical, 1994
- The mechanism of field-assisted silicon-glass BondingSensors and Actuators A: Physical, 1990
- Low-temperature silicon-to-silicon anodic bonding with intermediate low melting point glanSensors and Actuators A: Physical, 1990
- A capacitive pressure sensor with low impedance output and active suppression of parasitic effectsSensors and Actuators A: Physical, 1990