Wafer bonding and H-implantation mechanisms involved in the Smart-cut® technology
- 30 April 1997
- journal article
- Published by Elsevier in Materials Science and Engineering: B
- Vol. 46 (1-3) , 14-19
- https://doi.org/10.1016/s0921-5107(96)01923-x
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Silicon on insulator material technologyElectronics Letters, 1995
- Silicon‐On‐Insulator by Wafer Bonding: A ReviewJournal of the Electrochemical Society, 1991
- A Model for the Silicon Wafer Bonding ProcessJapanese Journal of Applied Physics, 1989
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986