Interaction relation in 60Sn–Pb–0.05La ternary solder alloy
- 31 October 2002
- journal article
- research article
- Published by Elsevier in Materials Letters
- Vol. 56 (4) , 441-445
- https://doi.org/10.1016/s0167-577x(02)00521-9
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- The electronegativity parameter for transition metals: Heat of formation and charge transfer in alloysPublished by Elsevier ,2003
- Strengthening Sn60–Pb40 solder alloy by adding trace amount of LaMaterials Letters, 2002
- Effect of La on the Sn-rich halo formation in Sn60–Pb40 alloyJournal of Alloys and Compounds, 2001
- A general solution model for predicting ternary thermodynamic propertiesPublished by Elsevier ,2000
- Thermodynamic assessment of the Cu–La systemJournal of Alloys and Compounds, 1999
- A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnectionsMetallurgical and Materials Transactions A, 1998
- Solders in electronicsJournal of Materials Science, 1996
- Eutectic growth: A modification of the Jackson and Hunt theoryActa Metallurgica et Materialia, 1991
- Surface tension of binary liquid alloysScripta Metallurgica, 1987