A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections
- 1 December 1998
- journal article
- Published by Springer Nature in Metallurgical and Materials Transactions A
- Vol. 29 (12) , 2951-2956
- https://doi.org/10.1007/s11661-998-0202-2
Abstract
No abstract availableKeywords
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