Investigation of crack propagation in ceramic/conductive epoxy/glass systems
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (3) , 627-633
- https://doi.org/10.1109/95.465162
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Role of materials evolution in VLSI plastic packages in improving reflow soldering performancePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Matrix Cracking-Induced Delamination Propagation in Graphite/Epoxy Laminated Composites Due to a Transverse Concentrated LoadPublished by ASTM International ,1993
- Mixed Mode Cracking in Layered MaterialsPublished by Elsevier ,1991