Effect of material interactions during thermal shock testing on IC package reliability
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 693-700
- https://doi.org/10.1109/ectc.1993.346774
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Molding Compound Trends In A Denser Packaging World. I. Technology EvolutionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Development of high-reliability epoxy molding compounds for surface-mount devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Effect of combination between various polyimide coating materials and molding compounds on the reliability of integrated circuits (ICs)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Progression of damage caused by temperature cycling on a large die in a molded plastic packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Relation between delamination and temperature-cycling induced failures in plastic packaged devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The impact of delamination on stress-induced and contamination-related failure in surface mount ICsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- Effects of Configuration on Plastic Package StressesJournal of Electronic Packaging, 1991
- Test structures and finite element models for chip stress and plastic package reliabilityPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990
- Low-Stress Resin Encapsulants for Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Computer Aided Stress Modeling for Optimizing Plastic Package Reliability8th Reliability Physics Symposium, 1985