Progression of damage caused by temperature cycling on a large die in a molded plastic package
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Finite element analysis of compliant coatingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Low-stress polyimide resin for ICPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A photo-patternable stress relief material for plastic packaged integrated circuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Shear Stress Evaluation of Plastic PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Low-Stress Resin Encapsulants for Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Deformation of AL Metallization in Plastic Encapsulated Semiconductor Devices Caused by Thermal Shock8th Reliability Physics Symposium, 1980