Relation between delamination and temperature-cycling induced failures in plastic packaged devices
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Shear Stress Evaluation of Plastic PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal ShockPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1987
- Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985