Grain growth in thin aluminum-4% copper alloy films
- 1 November 1975
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 30 (1) , 137-143
- https://doi.org/10.1016/0040-6090(75)90315-6
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Formation of second phase particles in aluminum-copper alloy filmsThin Solid Films, 1972
- Effect of Microstructure on the Electromigration Life of Thin-Film A1–Cu ConductorsJournal of Applied Physics, 1972
- Diffusion in AluminiumInternational Materials Reviews, 1972
- Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film ConductorsJournal of Applied Physics, 1971
- Grain size measurement by the intercept methodMetallography, 1971
- Growth of grain boundary precipitates in Al-4% Cu by interfacial diffusionActa Metallurgica, 1968