Applications of X-Ray Radiography to the Study of Porosities in Surface Mount Solder Joints
- 1 January 1994
- book chapter
- Published by Springer Nature
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Application of Non‐destructive Testing to Inspection of Soldered JointsCircuit World, 1989
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1989
- Soldering Handbook for Printed Circuits and Surface MountingPublished by Springer Nature ,1986