Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
- 1 November 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (11) , 1229-1235
- https://doi.org/10.1007/s11664-998-0074-7
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *Soldering & Surface Mount Technology, 1996
- Investigation of multi-component lead-free soldersJournal of Electronic Materials, 1994
- Improved mechanical properties in new, Pb-free solder alloysJournal of Electronic Materials, 1994
- Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials, 1994
- New lead-free, Sn-Zn-In solder alloysJournal of Electronic Materials, 1994
- New, lead-free soldersJournal of Electronic Materials, 1994
- On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb SolderJournal of Electronic Packaging, 1991
- Thermal fatigue evaluation of solder alloys. Final reportPublished by Office of Scientific and Technical Information (OSTI) ,1980