Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
- 1 June 2001
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 307 (1-2) , 42-50
- https://doi.org/10.1016/s0921-5093(00)01958-4
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder AlloyJournal of Electronic Packaging, 1999
- A modified energy-based low cycle fatigue model for eutectic solder alloyScripta Materialia, 1999
- Effect of intermetallic compounds on the thermal fatigue of surface mount solder jointsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997
- Constitutive relations for tin-based solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992