Thermal evaluations of 144 pin plastic flat packs

Publisher Website

1 January 1989

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 14-18
https://doi.org/10.1109/stherm.1989.76058

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

Finite element thermal analysis of 144 pin plastic flat packs
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1989
Forced Convective Heat Transfer from LSI Packages in an Air-Cooled Wiring card Array
Heat Transfer Engineering, 1988
Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment
International Journal of Heat and Mass Transfer, 1982
Thermal Characteristics of 16- and 40-Pin Plastic DIP's
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981