Finite element thermal analysis of 144 pin plastic flat packs
- 1 January 1989
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Thermal evaluations of 144 pin plastic flat packsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1989
- Heat Transfer & Thermal Stress Analysis of Plastic-Encapsulated ICsIEEE Transactions on Reliability, 1985
- Thermal Characteristics of 16- and 40-Pin Plastic DIP'sIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981