Demonstration of on-PCB optical interconnection using surface-mount package and polymer waveguide

This publication has 15 references indexed in Scilit:

• Optoelectronic packaging and polymer waveguides for multichip module and board-level optical interconnect applications
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Implementation and prospects for chip-to-chip free-space optical interconnects
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Two-dimensional optical interconnect between CMOS IC's
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Scalability analysis of diffractive optical element-based free-space photonic circuits for interoptoelectronic chip interconnections
  Applied Optics, 2001
• Hybrid integration of polymer microlens with VCSEL using drop-on-demand technique
  Published by SPIE-Intl Soc Optical Eng ,2000
• New technology for electrical/optical systems on module and board level: the EOCB approach
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2000
• Three-dimensional board-to-board free-space optical interconnects and their application to the prototype multiprocessor system: COSINE-III
  Applied Optics, 1995
• Gigabit Optical Interconnects For The Connection Machine
  Published by SPIE-Intl Soc Optical Eng ,1990
• Planar integration of free-space optical components
  Applied Optics, 1989
• Comparison between optical and electrical interconnects based on power and speed considerations
  Applied Optics, 1988