The design of some novel 0.050-in. grid high-density circuit pack-to-backplane connectors
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Electrical and mechanical properties of a metal-filled polymer composite for interconnection and testing applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- New, Z-direction anisotropically conductive compositesJournal of Applied Physics, 1988
- Interconnection System Requirements and ModelingAT&T Technical Journal, 1987
- Qualification of Connectors Manufactured with Diffused Gold R156 Inlay ContactsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983