High aspect-ratio dry-release poly-silicon MEMS technology for inertial-grade microgyroscopes
- 7 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 74, 304-308
- https://doi.org/10.1109/plans.2000.838318
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Recent advances in silicon etching for MEMS using the ASE™ processSensors and Actuators A: Physical, 1999
- Micromachined inertial sensorsProceedings of the IEEE, 1998
- Bent-beam strain sensorsJournal of Microelectromechanical Systems, 1996