Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates
- 1 January 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (4) , 699-708
- https://doi.org/10.1109/96.544360
Abstract
No abstract availableKeywords
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