Performance, wireability, and cooling tradeoffs for planar and 3-D packaging architectures
- 1 May 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (2) , 339-345
- https://doi.org/10.1109/96.386271
Abstract
No abstract availableKeywords
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