An overview and analysis of 3D WSI

This publication has 10 references indexed in Scilit:

• The 3-D computer
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• 3D interconnection for ultra-dense multichip modules
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• A study of high density multilayer LSI
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Transient and crosstalk analysis of slightly lossy interconnection lines for wafer scale integration and wafer scale hybrid packaging-weak coupling case
  IEEE Transactions on Circuits and Systems, 1988
• On the feasibility of through-wafer optical interconnects for hybrid wafer-scale-integrated architectures
  IEEE Transactions on Electron Devices, 1987
• Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
• SOI/SOI/Bulk-Si triple-level structure for three-dimensional devices
  IEEE Electron Device Letters, 1986
• Interconnection lengths and VLSI
  IEEE Circuits and Devices Magazine, 1985
• Placement and average interconnection lengths of computer logic
  IEEE Transactions on Circuits and Systems, 1979
• On a Pin Versus Block Relationship For Partitions of Logic Graphs
  IEEE Transactions on Computers, 1971