Passively assembled optical interconnection system based on an optical printed-circuit board
- 21 February 2006
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 18 (5) , 652-654
- https://doi.org/10.1109/lpt.2006.870127
Abstract
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.Keywords
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