Electroless Deposition of TiO[sub 2]∕Ti onto Aluminum Substrates
- 1 January 2007
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 154 (7) , D346
- https://doi.org/10.1149/1.2734100
Abstract
No abstract availableKeywords
This publication has 32 references indexed in Scilit:
- Electrodeposition of Ti from TiCl4 in the ionic liquid l-methyl-3-butyl-imidazolium bis (trifluoro methyl sulfone) imide at room temperature: study on phase formation by in situ electrochemical scanning tunneling microscopyElectrochimica Acta, 2004
- Characterisation of a duplex TiO2/CaP coating on Ti6Al4V for hard tissue replacementBiomaterials, 2004
- Controlling factors affecting the stability and rate of electroless copper platingMaterials Letters, 2003
- Hemocompatibility of titanium oxide filmsBiomaterials, 2003
- Review: deposition of ceramic thin films at low temperatures from aqueous solutionsSolid State Ionics, 2002
- Impedance and Morphological Properties of Electroless Gold on Industrial Metal CouponsLangmuir, 2001
- Influence of pH and fluoride concentration on titanium passivating layer: stability of titanium dioxideTalanta, 2001
- Surface chemistry and rheological behaviour of titania pigment suspensionsColloids and Surfaces A: Physicochemical and Engineering Aspects, 1999
- Titanium alloys in total joint replacement—a materials science perspectiveBiomaterials, 1998
- Cyclic voltammetry at mercury microelectrodes. Effects of mercury thickness and scan rateElectrochimica Acta, 1996