Controlling factors affecting the stability and rate of electroless copper plating
- 11 June 2003
- journal article
- research article
- Published by Elsevier in Materials Letters
- Vol. 58 (1-2) , 104-109
- https://doi.org/10.1016/s0167-577x(03)00424-5
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Direct electroplating on printed circuit boardsMetal Finishing, 2001
- Effects of Thiourea and Guanidine Hydrochloride on Electroless Copper PlatingJournal of the Electrochemical Society, 1985
- The Effect of Some Additives on Electroless Copper DepositionJournal of the Electrochemical Society, 1983
- The Use of Organic Additives to Stabilize and Enhance the Deposition Rate of Electroless Copper PlatingJournal of the Electrochemical Society, 1972