Direct electroplating on printed circuit boards
- 30 April 2001
- journal article
- Published by Elsevier in Metal Finishing
- Vol. 99 (4) , 51-54
- https://doi.org/10.1016/s0026-0576(01)85354-x
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- A Search for the Mechanism of Direct Copper Plating via Bridging LigandsJournal of the Electrochemical Society, 1996
- Direct Electroplating on NonconductorsJournal of the Electrochemical Society, 1995
- The use of conducting polymers and colloids in the through hole plating of printed circuit boardsElectrochimica Acta, 1994
- Conveyorised Horizontal System for PTH Using a Conductive Palladium Compound Direct Plate ProcessTransactions of the IMF, 1994