The use of conducting polymers and colloids in the through hole plating of printed circuit boards
- 30 June 1994
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 39 (8-9) , 1325-1338
- https://doi.org/10.1016/0013-4686(94)e0055-5
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Applications of SPM in the metal plating industryScanning, 1993
- An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additiveJournal of Electroanalytical Chemistry, 1992