Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
- 15 November 1998
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 84 (10) , 5547-5553
- https://doi.org/10.1063/1.368856
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- Full copper wiring in a sub-0.25 μm CMOS ULSI technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Microstructure and Texture of Electroplated Copper in Damascene StructuresMRS Proceedings, 1998
- Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. II. X-ray investigation of primary recrystallizationJournal of Applied Electrochemistry, 1985
- The internal stress in thin silver, copper and gold filmsThin Solid Films, 1985
- The Structure of Electroplated and Vapor-Deposited Copper FilmsJournal of Applied Physics, 1972
- Room-Temperature Recrystallization in Thick Bias-Sputtered Copper DepositsJournal of Applied Physics, 1971
- The Structure of Electrodeposited Copper Examined by X-Ray Diffraction TechniquesJournal of the Electrochemical Society, 1965