High Performance Silicone Gel as IC Device Chip Protection

This publication has 9 references indexed in Scilit:

• Patent Culture Samples: The ‘Expert Solution’ for Europe
  Bio/Technology, 1986
• United States patent
  Geothermics, 1985
• A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
• Thermogravimetric Analysis of Silicone Elastomers as Integrated Circuit Device Encapsulants
  Published by American Chemical Society (ACS) ,1984
• Ultrahigh sensitivity uranium analyses using fission track counting: Further analyses of semiconductor packaging materials
  Journal of Radioanalytical and Nuclear Chemistry, 1982
• A Moisture Protection Screening Test for Hybrid Circuit Encapsulants
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
• Diaza-polyoxa-macrocycles et macrobicycles
  Tetrahedron Letters, 1969
• Encapsulation of integrated circuits
  Proceedings of the IEEE, 1969
• Cyclic polyethers and their complexes with metal salts
  Journal of the American Chemical Society, 1967