Flexible integration of nonsilicon microstructures on microelectronic circuits

Publisher Website

27 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/memsys.1998.659765

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

Molding process with high alignment precision for the LIGA technology
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2005
Fabrication of microcomponents using adhesive bonding techniques
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
Hot embossing - The molding technique for plastic microstructures
Microsystem Technologies, 1998
Acceleration sensor with integrated compensation of temperature effects fabricated by the LIGA process
Sensors and Actuators A: Physical, 1994