Semiconductor wafer bonding
- 1 August 1990
- journal article
- Published by Wiley in Advanced Materials
- Vol. 2 (8) , 372-374
- https://doi.org/10.1002/adma.19900020809
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Interface charge control of directly bonded silicon structuresJournal of Applied Physics, 1989
- Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological EvaluationsJapanese Journal of Applied Physics, 1989
- Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom EnvironmentJapanese Journal of Applied Physics, 1988
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986