Thermomigration of interstitial-solute-vacancy pairs in a dilute fcc alloy
- 15 January 1976
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review B
- Vol. 13 (2) , 635-640
- https://doi.org/10.1103/physrevb.13.635
Abstract
The influence of a temperature gradient on the motion of an interstitial-solute-vacancy pair in a fcc alloy has been analyzed using the "pair association" kinetic theory developed by Lidiard. In the past, an interstitial-solute-vacancy pair mechanism has been used to describe the diffusion of various solutes in the group-IV elements, and this development for the kinetics of the thermomigration of such solute-vacancy pairs can be used for further evaluation of this proposed mechanism for diffusion in these alloys.Keywords
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