The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization
- 4 November 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and NiChemistry of Materials, 2002
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995