Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni
- 28 February 2002
- journal article
- research article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 14 (3) , 949-951
- https://doi.org/10.1021/cm010639h
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Reactions of lead-free solders with CuNi metallizationsJournal of Electronic Materials, 2000
- Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich soldersJournal of Electronic Materials, 1996