Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
- 1 July 1996
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 25 (7) , 1113-1120
- https://doi.org/10.1007/bf02659912
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995
- Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials, 1994
- In search of new lead-free electronic soldersJournal of Electronic Materials, 1994
- Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials, 1994
- Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials, 1994
- New lead-free, Sn-Zn-In solder alloysJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Lead‐free Solders for Electronic Packaging and AssemblyCircuit World, 1994
- The Search for Lead‐free SoldersSoldering & Surface Mount Technology, 1993