Lead‐free Solders for Electronic Packaging and Assembly

Publisher Website
Google Scholar
Abstract
In terms of science, technologies and end‐use applications, ‘lead‐free solders’ are a very broad subject. This paper is intended to highlight the key issues of this broad subject for its applications in electronic packaging and assembly. The areas covered include the main thrusts behind the research and development effort, the scientific approaches, economic and practical considerations, and regulatory and legislative perspectives of lead. In addition, this paper will present the new findings as a result of research and development effort on lead‐free solders. Technologically, in view of the current and future needs in interconnecting materials, the first objective of this work is to demonstrate the ability to provide lead‐free solders in lieu of conventional lead‐bearing solders without mandating significant changes in manufacturing processes and/or equipment which have been established and proven in the industry. The second objective is to design the lead‐free solders which are able to offer superior performance to their Sn/Pb counterparts, thus providing solder interconnections with higher reliability and endurance during service life. The fulfilment of these two objectives will concurrently address the two critical technological areas in the field of solders, namely the inherent vulnerability of conventional solders to temperature and stress, and the concerns of toxicity and health hazard of lead. Based on materials principles, ternary and quaternary lead‐free systems are at present being designed. The work conducted thus far demonstrates that two of the designed solder compositions show great promise. In comparison with 63Sn/37Pb eutectic solder, the new lead‐free compositions exhibit superior performance in shear strength, creep resistance and thermomechanical fatigue resistance. This paper will also cover the data in mechanical testings, the summary of microstructure evaluation (with detailed elucidation omitted), and low‐cycle fatigue fractoqraphy examination of the designed lead‐free compositions.

This publication has 3 references indexed in Scilit: