Reactions of lead-free solders with CuNi metallizations
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1194-1199
- https://doi.org/10.1007/s11664-000-0012-9
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Development of under bump metallizations for flip chip bonding to organic substratesJournal of Electronic Materials, 1999
- Flip Chip Metallurgies for Lead-Free SoldersMRS Proceedings, 1998
- Under Bump Metallization Development for Eutectic Pb-Sn SoldersMRS Proceedings, 1998
- Reactions of solid copper with pure liquid tin and liquid tin saturated with copperScripta Materialia, 1997
- High Sn solder reaction with Cu metallizationScripta Materialia, 1996
- Rate of consumption of Cu in soldering accompanied by ripeningApplied Physics Letters, 1995
- Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and CuApplied Physics Letters, 1995