High performance air cooled heat sinks for integrated circuits
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 1022-1031
- https://doi.org/10.1109/33.62544
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Thermal Management of Air- and Liquid-Cooled Multichip ModulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Thermal management in semiconductor device packagingProceedings of the IEEE, 1985
- Narrow Channel Forced Air Heat SinkIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- A Conduction-Cooled Module for High-Performance LSI DevicesIBM Journal of Research and Development, 1982
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981