Fracture strength measurement of filament assisted CVD polycrystalline diamond films
- 1 June 1992
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 7 (6) , 1432-1437
- https://doi.org/10.1557/jmr.1992.1432
Abstract
The fracture strength of polycrystalline diamond films deposited by filament assisted chemical vapor deposition in the thickness range of 3.5 to 160 μm is investigated. Using a burst pressure technique, the fracture strengths of circular diamond film specimens are calculated. An average fracture strength of 730 MPa for nine samples was computed. This value is in good agreement with published strengths of microwave plasma deposited diamond films, comparable to other high strength materials, and within an order of magnitude of the fracture strength of bulk natural diamond. The average fracture strength of the fine-grained substrate interface appears consistently higher than that of the coarse-grained diamond growth surface.Keywords
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