A Further Study on the Microstructure of Glass-Bonded Ag Thick-Film Conductors
- 1 September 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (3) , 281-285
- https://doi.org/10.1109/tchmt.1984.1136356
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- An Investigation into the Optimum Thickness of Titanium Dioxide Thin Films Synthesized by Using Atmospheric Pressure Chemical Vapour Deposition for Use in Photocatalytic Water OxidationChemistry – A European Journal, 2010
- Sintering and microstructure development of glass-bonded silver thick filmsJournal of Materials Science, 1984
- Adhesion, phase morphology, and bondability of reacttvely-bonded and frit-bonded gold and silver thick-film conductorsJournal of Electronic Materials, 1974