Interconnect technologies and the thermal performance of MCM
- 2 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The author compares the thermal performance of multi-chip modules (MCMs) based on their interconnection technology. The comparisons were made for hermetic and conduction cooled use environments. The thermal performances of the chip-first high-density interconnect (HDI) technology, the flipped-chip (FC) technology, and flipped-tape automated bonding (FTAB) technologies were analyzed and compared for MCM applications. The results of the study showed the thermal performance of each interconnect technology and presented the most effective ways to improve the performance of MCMs.Keywords
This publication has 4 references indexed in Scilit:
- Thermally Conductive Ceramics for Electronic PackagingJournal of Electronic Packaging, 1989
- Thermal management in semiconductor device packagingProceedings of the IEEE, 1985
- Conduction Cooling for an LSI Package: A One-Dimensional ApproachIBM Journal of Research and Development, 1982
- A Conduction-Cooled Module for High-Performance LSI DevicesIBM Journal of Research and Development, 1982