The interaction between different barrier metals and the copper surface during the chemical-mechanical polishing
- 30 November 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 37-38, 237-243
- https://doi.org/10.1016/s0167-9317(97)00117-2
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Characterization of Cu chemical mechanical polishing by electrochemical investigationsMicroelectronic Engineering, 1997
- Chemical-mechanical polishing of copper for interconnect formationMicroelectronic Engineering, 1997
- Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper StructuresJournal of the Electrochemical Society, 1994